🔴 Hot Update: pcdesign

NEWS

PCB East 2027 Conference Registration Now Open

05 November 2026

PEACHTREE CITY, GA – The Printed Circuit Engineering Association (PCEA (https://pcea.net)) opened registration for the technical program for PCB East (https://w... Read More...

Luminovo Opens Its Electronics Supply Chain Platform to AI Assistants Like ChatGPT, Claude, and Microsoft Copilot

04 November 2026

MUNICH – Luminovo, the AI platform for the electronics supply chain, is opening its software to AI assistants like ChatGPT, Claude, and Microsoft Copilot throug... Read More...

MediaTek Expands AI ASIC Business, Targets Advanced Packaging Yields

03 November 2026

HSINCHU, TAIWAN -- MediaTek reported third-quarter 2026 revenue of $5.25 billion, up 18.3% year-over-year, as the semiconductor company expanded its artificial ... Read More...

Isu Petasys Plans $350M PCB Plant in Daegu

03 November 2026

DAEGU, SOUTH KOREA -- Isu Petasys plans to invest approximately $350 million (500 billion won) to construct its seventh manufacturing plant in Daegu, South Kore... Read More...

Global Semiconductor Sales Jump 24% in Third Quarter

03 November 2026

WASHINGTON, DC -- Global semiconductor sales reached $517.7 billion in the third quarter of 2026, up 24.1% from the previous quarter, according to the Semicondu... Read More...

Amphenol Signs Deal to Acquire AdvancedPCB

30 October 2026

WALLINGFORD, CT -- Amphenol has signed a definitive agreement to acquire AdvancedPCB, a leading US manufacturer of printed circuit boards for the defense and in... Read More...

NCAB Group Q3 Orders Surge 166%

27 October 2026

STOCKHOLM, SWEDEN – NCAB Group reported a 166% year-over-year increase in order intake for the third quarter of 2026, reaching approximately $263.9 million, as ... Read More...

Ventec Opens Thailand Manufacturing Facility, Invests $50M in China Expansion

27 October 2026

THAILAND – Ventec International Group has opened its first manufacturing facility in Southeast Asia, establishing a production base in Thailand as part of its g... Read More...

North American PCB Orders Surge 229% in September as Shipments Decline

27 October 2026

BANNOCKBURN, IL – North American printed circuit board orders surged 229.4% year-over-year in September 2026, while shipments declined 6.4%. Read More...

PCEA Announces 2027-28 Board of Directors

26 October 2026

PEACHTREE CITY, GA – The Printed Circuit Engineering Association (PCEA (https://pcea.net)) today announced its Board of Directors for the 2027-28 term. Anaya Va... Read More...

Epec Acquires Standard Printed Circuits

26 October 2026

NEW BEDFORD, MA – Epec Engineered Technologies has acquired Standard Printed Circuits (SPC), a US manufacturer of advanced printed circuit boards, expanding its... Read More...

SEMI Forecasts 11% Growth in Silicon Wafer Shipments for 2026

21 October 2026

MILPITAS, CA – Global silicon wafer shipments are projected to increase 11.8% in 2026 to 14,420 million square inches (MSI), driven by demand for artificial int... Read More...

Schmid Group Secures $29M Equipment Order for HDI Expansion in Malaysia

21 October 2026

FREUDENSTADT, GERMANY – Schmid Group has reached an agreement with a long-standing customer and technology partner on an equipment order valued at more than $29... Read More...

Schmid Raises 2026 Order Intake Forecast After Strong Q3

21 October 2026

FREUDENSTADT, GERMANY – Schmid Group reported preliminary third-quarter 2026 revenue of approximately $28 million and order intake of $79 million, more than dou... Read More...

Upcoming PCEA PCB Design Training Classes for 2027

20 October 2026

PEACHTREE CITY, GA – PCEA Training (https://pceatraining.net) announced its winter and spring 2027 schedule for the Certified Professional Circuit Designer (CPC... Read More...

FEATURES

Embedded Die Substrate Technology

Embedded die substrate technology combines thick copper heat spreaders, sintered silver die attach and copper microvias to improve thermal management, reduce pa... Read More...

Stackup Decisions That Prevent EMI Problems Later

A seemingly harmless low-speed feedback trace caused an 18dB emissions failure, demonstrating why stackup reviews must account for high-impedance nets and retur... Read More...

Layout and Connector Footprint Strategies for Industrial EMC and Signal Integrity

Connector footprint design plays a critical role in electromagnetic compatibility and signal integrity, with return paths, shielding and grounding strategies he... Read More...

Selecting Via Protection for PCB Design and Manufacturing

Selecting the right via protection method requires balancing design requirements, material properties, assembly reliability and manufacturing costs. When apply... Read More...

Building Your Own IoT: Equipment Monitoring for New and Legacy Systems

PCB fabricators can pair IoT monitoring with AI to track equipment behavior, troubleshoot setups and build useful operating records. Walk through a printed cir... Read More...

NTI-100: AI is Reshaping the PCB Industry

Advanced substrates and high-layer-count boards, not smartphones and PCs, are now the growth engine. How things change in just one generation. If we look back ... Read More...

Managing Vias in Very High Data-Rate Differential Pairs

Managing via structures can minimize signal degradation and enable differential pairs to operate at data rates as high as 56Gb/s. Vias are the plated through-h... Read More...

PCB Designers Earn More, Do More: The 2026 Compensation Picture

The 2026 PCD F Salary Survey examines compensation, workloads, career satisfaction and the evolving role of PCB designers across the electronics industry. If y... Read More...

Flex DfM Guidelines, Part 2

Proper flex PCB outline design, shielding and stiffener placement help improve manufacturability, durability and long-term reliability in demanding applications... Read More...

High-Power Thermal Management: Two-Layer IMS Design Considerations

As power electronics become more compact and power-dense, two-layer IMS PCB designs are helping improve thermal management, reliability and EMI performance in h... Read More...

AI Is Reshaping the Semiconductor Supply Chain

AI-driven demand is reshaping semiconductor supply chains, prompting manufacturers to prioritize capacity, adjust pricing and tighten availability for mature-no... Read More...

The Workday You Lose to Documentation, and How to Get It Back

AI can turn routine reports, meeting notes and work instructions into editable first drafts, helping engineering teams reclaim hours each week for higher-value ... Read More...

Why Don’t UHDI Capability Charts Tell the Whole Story?

Understanding the difference between process capability and design intent enables engineers to maximize UHDI performance while improving manufacturability and y... Read More...

Flex DfM Guidelines, Part 1

Understanding key flex DfM guidelines can improve yields, reduce production risks and enhance long-term product reliability. Design for manufacturability (DfM)... Read More...

The Charge of the Bucket Brigade

An exploration of the PDN bucket brigade concept as a practical way to understand time-domain energy delivery in high-speed PCB design. Why do otherwise good P... Read More...